PSPT-A – Preparation tools for Peel strength test
Tools very useful with PST-E Peel Strength Test.
PSPT-Ax pre-cuts the card with a cutter for preparing test sections as described in ISO 10373-1 and MasterCard CQM.
- PSPT-A-H: version for four horizontal and one vertical sections.
- PSPT-A-H: version for seven vertical and one horizontal sections.
Tools very useful with PST-E Peel Strength Test.
PSPT-Ax pre-cuts the card with a cutter for preparing test sections as described in ISO 10373-1 and MasterCard CQM.
- PSPT-A-H: version for four horizontal and one vertical sections.
- PSPT-A-H: version for seven vertical and one horizontal sections.
Upsell Products
PST-E – Card Peel Strength Test Tool
The PST test tool is designed according to industry specification for card peel testing. The digital strain gauge installed can be connected to a PC with Go/No-Go assistant Mulann utility for data recording via RS-232 cable supplied with the device. This tester needs to work with the PSPT-A tools. PSPT-A has two versions for one cut or four cuts.
Latest Products
IBS-E – ICC Backside Spot Pressure Test Tool
The IBS tool is designed according to CQM to perform backside spot pressure test, it works with the preparation tool on the right side. This version comes with digital gauge connected to a PC and a dedicated utility.
WTT-D-5-R20_25 Multiple Cards Wrapping Test Tool for Durability
The WTT-D-5-R20_25 is a tool designed to test at the same the resistance to static wrapping stress of 10 IC module embedded into ID1 cards format .
IMT-A – Card Impact Test Tool
The IMT-A test tool has been designed according to industry specification for card body impact testing.
TPT-A – Tape Pull Test Tool
The TPT-A is a tape pull test tool targeted for complying to CQM requirements (Test methods TM-B04-3 tape pull test). It enables a quick and simple way for qualifying your products. (Note: Test adhesives are not included).
WTT-A – Card Wrapping Test Tool
The WTT-A tool is a set of two fixtures (¼ radius: 25, 20mm) designed to test the resistance to dynamic wrapping stress of an IC module embedded into an ID1 card format.