PST-E – Card Peel Strength Test Tool
The PST test tool is designed according to industry specification for card peel testing. The digital strain gauge installed can be connected to a PC with Go/No-Go assistant Mulann utility for data recording via RS-232 cable supplied with the device. This tester needs to work with the PSPT-A tools. PSPT-A has two versions for one cut or four cuts.
The PST test tool is designed according to industry specification for card peel testing. The digital strain gauge installed can be connected to a PC with Go/No-Go assistant Mulann utility for datra recording via RS-232 cable supplied with the device. This tester needs to work with the PSPT-A tools. PSPT-A has two versions for one cut or four cuts.
Applications
The PST-E Peel strength tester is designed to test the resistance of the added protective overlay on any ID-1 smart cards.
It complies with ISO/ IEC 10373-1:2006 standard. and CQM v2.15 specifications (TM-412 test method )
– Card lamination quality control and production control
– New product introduction qualification The PST-E Peel strength tool shall be at least 3.5N/cm.
This tester also can be used to test peel strength of inlay antenna. This test needs to work with the PSPT-A tools. PSPT-A has two versions for one cut or four cuts.
Key benefits
– Easy-to-use equipment with preparation tool to cut printed card into equal sections as requested in the CQM test method specification
| Weight | 31 kg |
|---|---|
| Dimensions | 35 x 36.9 x 55 cm |
| Model | Evolution |
| Power supply | 110V AC 50/60Hz, 220V AC 50/60Hz, 6W rated power consumption |
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PSPT-A – Preparation tools for Peel strength test
Tools very useful with PST-E Peel Strength Test.
PSPT-Ax pre-cuts the card with a cutter for preparing test sections as described in ISO 10373-1 and MasterCard CQM.
- PSPT-A-H: version for four horizontal and one vertical sections.
- PSPT-A-H: version for seven vertical and one horizontal sections.
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The WTT-A tool is a set of two fixtures (¼ radius: 25, 20mm) designed to test the resistance to dynamic wrapping stress of an IC module embedded into an ID1 card format.
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